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DB 25
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Technisches Datenblatt Doortello Business Türtelefon
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DB 25
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Fingerprint access control with stainless steel plate for the use with Doortello Business door phones

Fingerprintmodule DB 25
  • Fingerprint access control for the use with Doortello Business door phones
  • One programmable driver contact function
  • Can store up to 150 fingerprints

Fingerprint access control device with stainless steel plate for up to 150 fingerprints. To operate the device a Dootello Business control unit (analog or SIP) is required. A standalone use is not possible.

The unit is connected to the DB controller using the DB bus. Also it is powered using the same connection. The driver contact function can be associated to any of the 18 driver contacts of the DB, or any of the 2 contacts of the DB SIP. It can be also used to start a call setup.

The programming of the driver contact function is done using the Doortello Business. The fingerprints itself are stored on the device using a master finger. Up to 150 fingerprints can be stored.

Standard features:

  • Programmable activation time (0 to 99 Sekunden), over DB
  • Programmable driver contact (1 of 18 DB 0x, 1 of 2 DB 0x SIP), over DB
  • Programmable dial number with or with out driver contact activation, over DB
  • In the door station intergrated or external (analog DB only) driver contact
  • Max. 3 master fingers
  • Up to 150 user fingers
  • Automatic timed lock on after 5 error attempts
  • Lock time enhance up to 1, 5, 30 and 60 minutes after every five more error attempts
  • Complete lock on after 5 x 5 error attempts
  • Lock release using master or a valid user finger
  • Delete all stored fingers using a master finger

Technical data:

  • Power supply: 12 Vac/dc, max. 50 mA, over DB Bus
  • Indicators: one green, one red and one blue LED
  • Memory capacity: ca. 150 fingerprints
  • Driver function: 1 driver function programmable over Doortello Business
  • Protection degree: IP 55
  • Dimensions HxLxD: 92 x 100 x 25 mm
  • Weight: 236 g
  • Operating temperature: -20° bis +50°C
  • Humidityt: 30 to 90% RH without condensing
  • Security: EN 60950
  • EMC: EN 55022:2006; EN 61000-6-1:2002
  • Approval: CE
  • Further norms: WEEE, RoHS
 
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